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HI FLOW Hi-Flow 225-F-AC Features & Benefits Thermal impedance: 0.10°C-in2/W (@25 psi) Can be manually or automatically applied to the … Continue ReadingHi-Flow 225-F-AC

Hi-Flow Hi-Flow 105 Features & Benefits Thermal impedance: 0.37°C-in2/W (@25 psi) Used where electrical isolation is not required Low volatility … Continue ReadingHi-Flow 105

ADHESIVES Bond-Ply 800 Features & Benefits Thermal impedance: 0.60°C-in2/W (@50 psi)  High bond strength to most epoxies and metals  Double-sided, … Continue ReadingBond-Ply 800

Adhesives Bond-Ply 660P Features & Benefits • Thermal impedance: 0.87°C-in2/W(@50 psi) Highly puncture resistant Polyimide reinforcement carrier Double-sided pressure sensitive … Continue ReadingBond-Ply 660P

Adhesives Bond-Ply 400 Features & Benefits  Thermal impedance: 0.87°C-in2/W(@50 psi)  Easy application Eliminates need for external hardware(screws, clips, etc.)  Available … Continue ReadingBond-Ply 400

ADHESIVES Bond-Ply 100 Features & Benefits  Thermal impedance 0.52°C-in2/W (@50 psi)  High bond strength to a variety of surfaces  Double-sided, … Continue ReadingBond-Ply 100

GAP FILLER Liqui Form 3500 Features & Benefits Thermal Conductivity: 3.5 W/m-K  Dispensable pre-cured gel  Stable viscosity in storage and … Continue ReadingLiqui Form 3500

GAP FILLER GAP FILLER 4000 Features & Benefits  Thermal Conductivity: 4.0 W/m-K  Extended working time for manufacturing flexibility  Ultra-conforming with … Continue ReadingGAP FILLER 4000

Gap Filler Gap Filler 3500LV Features & Benefits Thermal Conductivity: 3.5 W/m-K  Low volatility for outgassing sensitive applications  Ultra-conforming with … Continue ReadingGap Filler 3500LV

GAP FILLER GAP FILLER 3500S35 Features & Benefits  Thermal conductivity: 3.6 W/m-K  Thixotropic nature makes it easy to dispense  Two … Continue ReadingGAP FILLER 3500S35