ADHESIVES

Liqui-Form 2000

Features & Benefits

  • Thermal Conductivity: 2.0 W/m-K
  • Applies very low force on components during assembly
  • Low volumetric expansion
  • Excellent chemical and mechanical stability even at higher temperatures
  • No curing required
  • Stable viscosity in storage and in the application
liqui-form-2000-47f84205

Properties

Typical properties of Liqui-Form 2000
Properties Imperial Value Metric Value Test Method
Color Gray Gray Visual
Low Shear Viscosity (Pa*sec)@ 0.01 sec-1 (1) 20000 20000 ASTM D4473
High Shear Viscosity (Pa*sec)@ 300 sec-1 (2) 110 110 ASTM D2196
Volumetric Expansion (25 to 275°C), ppm/K 600 600 ASTM E228 modified
Outgassing, % Total Mass Loss 0.53 0.53 ASTM E595
Density (g/cc) 2.8 2.8 ASTM D792
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 ***2
Shelf Life at 25°C (Months) 6 6 ***2
Typical properties of Liqui-Form 2000
ELECTRICAL
Dielectric Strength (V/mil)/(V/mm) 250 10000 ASTM D149
Dielectric Constant (1000 Hz) 8.0 8.0 ASTM D150
Volume Resistivity (Ohm-meter) 10^9 10^9 ASTM D257
Flame Rating V-O/td> V-O U.L. 94
Typical properties of Liqui-Form 2000
THERMAL
Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470
Flame Rating V-O U.L.94
Typical properties of Liqui-Form 2000
Pressure (PSI) 10 25 50
Thermal Impedance (°C-in2/W) (3) 0.13 0.12 0.12