HI FLOW

Hi-Flow 650P

Features & Benefits

  •  Thermal Impedance: 0.20°C-in2/W (@25 psi)
  •  150°C high temperature reliability
  •  Natural tack one side for ease of assembly
  •  Exceptional thermal performance in an insulated pad

Properties

Typical properties of Hi-Flow 650P
Properties Imperial Value Metric Value Test Method
Color Gold Gold Visual
Reinforcement Carrier Polyimide Polyimide ***
Thickness (inch) / (mm) 0.0045 - 0.0055 0.114 - 0.140 ASTM D374
Film Thickness (inch) / (mm) 0.001 - 0.002 0.025 - 0.050 ASTM D374
Inherent Surface Tack (1 or 2-Side) 1 1 ***
Elongation (%) 40 40 ASTM D882A
Tensile Strength (psi) 7000 7000 ASTM D882A
Continuous Use Temp (°F / °C) 40 to 302 -40 to 150 ***
Phase Change Softening Temp (°F / °C) 126 52 ASTM D3418
Typical properties of Hi-Flow 650P
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 5000 5000 ASTM D149
Dielectric Constant (1000 Hz) 4.5 4.5 ASTM D150
Volume Resistivity (Ohm-meter) 10^12 10^12 ASTM D257
Flame Rating V-O V-O U.L. 94
Typical properties of Hi-Flow 650P
THERMAL
Thermal Conductivity (W/m-K)(1) 1.5 1.5 ASTM D5470
Typical properties of Hi-Flow 650P
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.0010" 1.20 1.15 1.11 1.06 1.00
TO-220 Thermal Performance (°C/W) 0.0015" 1.47 1.41 1.37 1.33 1.29
TO-220 Thermal Performance (°C/W) 0.0020" 1.59 1.48 1.43 1.38 1.35
Thermal Impedance (°C-in2 /W)(2) 0.0010" 0.21 0.20 0.19 0.18 0.17
Thermal Impedance (°C-in2 /W)(2) 0.0015" 0.23 0.22 0.21 0.20 0.20
Thermal Impedance (°C-in2 /W)(2) 0.0020" 0.27 0.27 0.26 0.25 0.24