Bond-Ply & Liqui Bond

Bond-Ply 100

Thermal impedance 0.52°C-in2/W (@50 psi)

Bond-Ply 400

Thermal impedance: 0.87°C-in2/W (@50 psi)

Bond-Ply 660P

Thermal impedance: 0.87°C-in2/W (@50 psi)

Bond-Ply 800

Thermal impedance: 0.60°C-in2/W (@50 psi)

Bond-Ply LMS-HD

TO-220 Thermal performances: 2.3°C/W, initial

Liqui-Bond EA 1805

Room temperature cure

Liqui-Bond SA 1000

High thermal performance

Liqui-Bond SA1800

High thermal conductivity: 1.8W/m-K

Liqui-Bond SA 2000

High thermal conductivity: 2.0 W/m-k

Liqui-Bond SA 3505

Thermal Conductivity: 3.5 W/m-K

Liqui-Form 2000

Thermal Conductivity: 2.0 W/m-K

TLB SA2005RT

Thermally conductive : 2.0 W/m-K

TLB 400 SLT