Gap Filler
Gap Filler 1100 SF
Features & Benefits
- Thermal Conductivity: 1.1 W/m-k
- No silicone outgassing or extraction
- Ultra-conforming, designed for fragile and low-stress applications
- Ambient and accelerated cure schedules
- 100% solids – no cure by-products
Properties
| Properties | Imperial Value | Metric Value | Test Method |
|---|---|---|---|
| Color / Part A | Yellow | Yellow | Visual |
| Color / Part B | Red | Red | Visual |
| Viscosity as Mixed (cps)(1) | 450,000 | 450,000 | ASTM D2196 |
| Density (g/cc) | 2.0 | 2.0 | ASTM D792 |
| Mix Ratio | 1:1 | 1:1 | *** |
| Shelf Life @ 25°C (months) | 6 | 6 | *** |
| PROPERTY AS CURED | |||
|---|---|---|---|
| Color | Orange | Orange | Visual |
| >Hardness (Shore 00)(2) | 60 | 60 | ASTM D2240 |
| >Heat Capacity (J/g-K) | 0.9 | 0.9 | ASTM E1269 |
| Continuous Use Temp (°F) / (°C) | -76 to 257 | -60 to 125 | *** |
| ELECTRICAL AS CURED | |||
|---|---|---|---|
| Dielectric Strength (V/mil) | 400 | 400 | ASTM D149 |
| Dielectric Constant (1000 Hz) | 5.0 | 5.0 | ASTM D150 |
| Volume Resistivity (Ohm-meter) | 10^10 | 10^10 | ASTM D257 |
| Flame Rating | V-O | V-O | U.L. 94 |
| THERMAL AS CURED | |||||
|---|---|---|---|---|---|
| Thermal Conductivity (W/m-K) | 1.1 | 1.1 | ASTM D5470 |
| CURE SCHEDULE | |||||
|---|---|---|---|---|---|
| Pot Life @ 25°C (3) | 240 min (4 hr) | 240 min (4 hr) | *** | ||
| Cure @ 25°C(4) | 24 | 24 | *** | ||
| Cure @ 100°C (4) | 10 | 10 | *** |