Gap Filler

Gap Filler TGF 1450

Features & Benefits

  • Thermal conductivity: 1.5 W/m-K
  • Ultra-conforming with excellent wet-out for near zero interface stress
  • No cure by-products
  • Low density for weight sensitive application
  • Excellent low and high temperature mechanical and chemical stability
  • Shear thinning viscosity for ease of dispensing
gap-filler-tgf-1450 (1)

Properties

Typical properties of Gap Filler 2000
Properties Imperial Value Metric Value Test Method
Color / Part A Blue Blue Visual
Color / Part B Light Blue Light Blue
Viscosity, High Shear (Pa-s)(1) 30 30 ASTM D5099
Viscosity, Low Shear (Pa-s)(2) 30 30 ASTM D5099
Density (g/cc) 1.8 1.8 ASTM D792
Mix Ratio 1:1 1:1
Shelf Life @ 25°C (months) 6 6 ASTM D792
Typical properties of Gap Filler 2000
PROPERTY AS CURED
Cplor Blue >Blue Visual
>Hardness (Shore 00)(2) 40 40 ASTM D2240
>Heat Capacity (J/g-K) 1.0 1.0 ASTM D1269
Continuous Use Temp (°F) / (°C) -76 to 347 -60 to 175
Typical properties of Gap Filler 2000
ELECTRICAL AS CURED
Dielectric Strength (V/mil) 275 275 ASTM D149
Dielectric Constant (1000 Hz) 6.4 6.4 ASTM D150
Volume Resistivity (Ohm-meter) 10^10 10^10 ASTM D257
Flame Rating V-O V-O U.L. 947
Typical properties of Gap Filler 2000
THERMAL AS CURED
Thermal Conductivity (W/m-K) 1.5 1.5 ASTM D5470
Typical properties of Gap Filler 2000
CURE SCHEDULE
Pot Life @ 25°C (3) 60 min 60 min ASTM D4473
Cure @ 25°C(4) 5 hours 5 hours ASTM D4473
Cure @ 100°C (4) 10 min 30 min ASTM D4473