HI FLOW

Hi-Flow 225-F-AC

Features & Benefits

  • Thermal impedance: 0.10°C-in2/W (@25 psi)
  • Can be manually or automatically applied to the surfaces of room temperature heat sinks
  • Foil reinforced, adhesive-coated
  • Soft, thermally conductive 55°C phase change compound
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Properties

Typical properties of Hi-Flow 225F-AC
Properties Imperial Value Metric Value Test Method
Color White White Visual
Reinforcement Carrier Aluminum Aluminum ***
Thickness (inch) / (mm) 0.004 0.102 ASTM D374
Carrier Thickness (inch) / (mm) 0.0015 0.038 ASTM D374
Continuous Use Temp (°F) / (°C) 248 120 ***
Phase Change Temp (°F) / (°C) 131 55 ASTM D3418
Typical properties of Hi-Flow 225F-AC
ELECTRICAL
Flame Rating V-O V-O U.L. 94
Typical properties of Hi-Flow 225F-AC
THERMAL
Thermal Conductivity (W/m-K) (1) 1.0 1.0 ASTM D5470
Typical properties of Hi-Flow 225F-AC
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.87 0.68 0.57 0.50 0.45
Thermal Impedance (°C-in2 /W) (2) 0.12 0.10 0.09 0.08 0.07