HI FLOW

Hi-Flow 300P

Features & Benefits

  • Thermal impedance: 0.13°C-in2/W (@25 psi)
  •  Field-proven polyimide film
  •  -excellent dielectric performance
  •  -excellent cut-through resistance
  •  Outstanding thermal performance in an insulated pad

Properties

Typical properties of Hi-Flow 300P
Properties Imperial Value Metric Value Test Method
Reinforcement Carrier Polymide Polymide ***
Color Green Green Visual
Typical Use Temp (°F) / (°C) 302 150 ***
Phase Change Temp (°F) / (°C) 131 55 ASTM D3418
Thickness (inch) / (mm) 0.004-0.005 0.102-0.127 ASTM D374
Elongation (%45° to Warp and Fill) 40 40 ASTM 882A
Tensile Strength (psi) / (MPa) 7000 48 ASTM 882A
Film Thickness (inch) / (mm) 0.001-0.002 0.025-0.050 ASTM D374
Typical properties of Hi-Flow 300P
Electrical Imperial Value Metric Value Test Method
Dielectric Breakdown Voltage (Vac) 5000 5000 ASTM D149
Dielectric Constant (1000 Hz) 4.5 4.5 ASTM D150
Volume Resistivity (Ohm-meter) 10^12 10^12 ASTM D257
Flame Rating V-O V-O U.L. 94
Typical properties of Hi-Flow 300P
Thermal Imperial Value Metric Value Test Method
Thermal Conductivity (W/m-K) (1) 1.6 1.6 ASTM D5470
Typical properties of Hi-Flow 300P
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.010" 0.95 0.94 0.92 0.91 0.90
TO-220 Thermal Performance (°C/W) 0.015" 1.19 1.17 1.16 1.14 1.12
TO-220 Thermal Performance (°C/W) 0.020" 1.38 1.37 1.35 1.33 1.32
Thermal Impedance (ºC-in2/W) 0.010" 0.13 0.13 0.12 0.12 0.12
Thermal Impedance (ºC-in2/W) 0.015" 0.17 0.16 0.16 0.16 0.15
Thermal Impedance (ºC-in2/W) 0.020" 0.19 0.19 0.19 0.18 0.18