Adhesives

Bond-Ply 660P

Features & Benefits

  • • Thermal impedance: 0.87°C-in2/W(@50 psi)
  • Highly puncture resistant Polyimide reinforcement carrier
  • Double-sided pressure sensitive adhesive tape
  •  Provides a mechanical bond, eliminating the need for mechanical fasteners or screws

Properties

Typical properties of Bond-Ply 660P
Properties Imperial Value Metric Value Test Method
Color Light Brown Light Brown Visual
Reinforcement Carrier Polyimide Film Polyimide Film ***
Glass Transition (°F) / (°C) -22 -30 ASTM E1356
Thickness (inch) / (mm) 0.008 0.203 ASTM D374
Continuous Use Temp (°F) / (°C) -40 to 257 -40 to 125 ***
Typical properties of Bond-Ply 660P
ADHESION
Lap Shear @ RT (psi) / (MPa) 100 0.7 ASTM D1002
Lap Shear after 5 hr @ 100°C 200 1.4 ASTM D1002
Lap Shear after 2 min @ 200°C 200 1.4 ASTM D1002
Typical properties of Bond-Ply 660P
Electrical Value Test Method
Dielectric Breakdown Voltage (Vac) 6000 ASTM D149
Flame Rating V-O U.L. 94
Typical properties of Bond-Ply 660P
THERMAL
Post-Cured Thermal Conductivity (W/m-K) 0.4 ASTM D5470
Thermal Impedance (°C-in2/W) 1.07 0.68 0.48
Typical properties of Bond-Ply 660P
THERMAL PERFORMANCE vs PRESSURE
Initial Assembly Pressure (psi for 5 seconds) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 5.48 5.47 5.15 5.05 5.00
Thermal Impedance (°C-in2 /W) (1) 0.83 0.82 0.81 0.80 0.79

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